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  this is information on a product in full production. october 2012 doc id 023250 rev 1 1/7 7 STTH602C-Y automotive ultrafast recovery diode datasheet ? production data features suited for smps low losses low forward and reverse recovery time high surge current capability high junction temperature description this dual center tap diode is suited for switch mode power supplies and high frequency dc to dc converters. packaged in dpak, this device is intended for use in low voltage high frequency inverters, free wheeling and polarity protection for automotive applications. table 1. device summary i f(av) 2 x 3 a v rrm 200 v t j (max) 175 c v f (typ) 0.80 v t rr (typ) 14 ns dpak stth602cby-tr a1 a1 k k a2 a2 www.st.com
characteristics STTH602C-Y 2/7 doc id 023250 rev 1 1 characteristics when the two diodes 1 and 2 are used simultaneously: ? tj(diode 1) = p (diode 1) x r th(j-c) (per diode) + p (diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.85 x i f(av) + 0.033 i f 2 (rms) table 2. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) rms forward current 11 a i f(av) average forward current, ? = 0.5 per diode t c = 160 c 3 a per device t c = 155 c 6 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 60 a t stg storage temperature range -65 to + 175 c t j operating junction temperature -40 to + 175 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case per diode 5 c/w per device 3.0 r th(c) coupling per diode 1 per diode 3 table 4. static electrical characteristics symbol parameter test conditions typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 3 a t j = 125 c 3 30 v f (2) forward voltage drop t j = 25 c i f = 3 a 0.98 1.1 v t j = 150 c 0.8 0.95 t j = 25 c i f = 6 a 1.1 1.25 t j = 150 c 0.9 1.05 1. pulse test: t p = 5 ms, ? < 2% 2. pulse test: t p = 380 s, ? < 2%
STTH602C-Y characteristics doc id 023250 rev 1 3/7 table 5. dynamic characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time i f = 1 a, di f /dt = -100 a/s, v r = 30 v, t j = 25 c 14 20 ns i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 21 30 i rm reverse recovery current i f = 3 a, di f /dt = 200 a/s, v r = 160 v, t j = 125 c 45.5 a t fr forward recovery time i f = 3 a, di f /dt = 200 a/s v fr = 1.1 x v fmax , t j = 25 c 24 ns v fp forward recovery voltage i f = 3 a, di f /dt = 200 a/s, t j = 25 c 3.7 v figure 1. peak current versus duty cycle (per diode) figure 2. forward voltage drop versus forward current (typical values per diode) 0 20 40 60 80 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i m (a) t d =tp/t tp i m t =tp/t tp i m p = 5 w p = 5 w p = 3 w p = 3 w p = 10 w p = 10 w t j =25c t j =150c v fm (v) figure 3. forward voltage drop versus forward current (maximum values per diode) figure 4. relative variation of thermal impedance junction to case versus pulse duration 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i fm (a) t j =25c t j =150c v fm (v) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z th(j-c) /r th(j-c) single pulse - tp(s)
characteristics STTH602C-Y 4/7 doc id 023250 rev 1 figure 9. dynamic parameters versus junction temperature figure 5. junction capacitance versus reverse applied voltage (typical values per diode) figure 6. reverse recovery charges versus di f /dt (typical values) 1 10 100 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v) 0 20 40 60 80 100 0 50 100 150 200 250 300 350 400 450 500 q rr (nc) i f =3a v r =160v t j =125c t j =25c di f /dt(a/s) figure 7. reverse recovery time versus di f /dt (typical values) figure 8. peak reverse recovery current versus di f /dt (typical values) 0 10 20 30 40 50 60 70 80 10 100 1000 t rr (ns) i f =3a v r =160v t j =125c t j =25c di f /dt(a/s) 0 2 4 6 8 10 0 50 100 150 200 250 300 350 400 450 500 i rm (a) i f =3a v r =160v t j =125c t j =25c di f /dt(a/s) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;i rm [t j ]/q rr ;i rm [t j =125c] i rm q rr i f =3a v r =160v t j (c)
STTH602C-Y package information doc id 023250 rev 1 5/7 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. footprint (dimensions in mm) table 6. dpak dimensions ref. dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
ordering information STTH602C-Y 6/7 doc id 023250 rev 1 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode stth602cby-tr stth602cby dpak 0.30 g 2500 tape and reel table 8. document revision history date revision changes 24-oct-2012 1 first issue.
STTH602C-Y doc id 023250 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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